DocumentCode :
3565857
Title :
Polymer TSV fabrication scheme with its electrical and reliability test vehicle
Author :
Shih-Wei Lee ; Jian-Yu Shih ; Ching-Te Chuang ; Wei Hwang ; Jin-Chern Chiou ; Kuo-Hua Chen ; Chi-Tsung Chiu ; Kuan-Neng Chen
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2014
Firstpage :
282
Lastpage :
285
Abstract :
In this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated.
Keywords :
polymers; reliability; three-dimensional integrated circuits; Kelvin structure; TSV technology; daisy chain; electrical test vehicle; humidity test; polymer TSV fabrication scheme; polymer liner formation; reliability test vehicle; thermal cycling; Cavity resonators; Materials reliability; Polymers; Reliability engineering; Resistance; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048407
Filename :
7048407
Link To Document :
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