DocumentCode :
3565894
Title :
Quantitative reliability prediction model for wafer level packages under board-level temperature cycling
Author :
Hung-Chun Yang ; Chin-Li Kao ; Tz-Cheng Chiu ; Chang-Chi Lee ; Sung-Ching Hung ; Chih-Pin Hung
Author_Institution :
Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2014
Firstpage :
325
Lastpage :
328
Abstract :
A damage accumulation based interconnect fatigue failure model is developed for predicting the board-level temperature cycling (T/C) reliability of wafer level packages (WLPs). Creep and constant strain rate experiments were first performed to characterize the viscoplastic constitutive behavior of Pb-free solder. Finite element (FE) analyses based on the viscoplastic models were conducted for estimating inelastic strain energy density accumulation. The numerical results were then compared to a library of board-level T/C reliability test results for best fitting the reliability model. Factors such as alloy Ag content, package geometry, and ball grid array (BGA) layout are considered in the model.
Keywords :
ball grid arrays; creep; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; silver; solders; viscoplasticity; wafer level packaging; BGA layout; FE analysis; WLP; ball grid array; board-level T-C reliability test; board-level temperature cycling reliability; constant strain rate experiments; damage accumulation; finite element analysis; inelastic strain energy density accumulation; interconnect fatigue failure model; lead-free solder; package geometry; quantitative reliability prediction model; reliability model; silver content; viscoplastic constitutive behavior; viscoplastic models; wafer level packages; Fatigue; Mathematical model; Numerical models; Predictive models; Reliability; Soldering; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048413
Filename :
7048413
Link To Document :
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