Three dimensional auto meshing flexibility CAE analysis for microchip encapsulation

The development of microchip product is complicated due to the complexity of material properties while processing. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. With the complexity of multiple material components, such as EMC, chip, or lead frame, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. CAE technology has provides a more scientific way to help people solving the problems and enhance the development. However, while the microchip product is getting more complex, it´s not easy for a designer to build up a mesh model for the CAE analysis efficiently. In view of this fact, this paper develops an innovative parallel true 3D mold filling simulation technology, which allows for the adoption of automatic mesh generation technique. The auto meshing tools simplify the model creation with prismatic control and allow designers to validate designs efficiently. The proposed methodology has allowed the user to perform analyses in much less time on complex model with flexible meshing and parallel processing capabilities. By using the integrated analysis, the developed approach proved from numerical experiments to be a cost-effective method for 3D simulation of molding process in microchip encapsulation.