• DocumentCode
    3565937
  • Title

    High speed SerDes design verification

  • Author

    Po-Chin Pan ; Hung-Hsiang Cheng ; Chen-Chao Wang

  • Author_Institution
    Electr. Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
  • fYear
    2014
  • Firstpage
    226
  • Lastpage
    229
  • Abstract
    Serial data (SerDes) link has been widely used in gigabit rate link, storage applications, telecom, data communications, etc. The ability to accurately predict SerDdes channel insertion loss and return loss plays a critical role in prediction of SerDes link performance. Two test vehicles are designed to demonstrate the step-by-step modeling technique. One is the bare package sample, and the other is the package on print circuit board (PCB) sample. In this paper, the SerDes signals are designed on both test vehicles and characterized through model to measurement correlation in section I. Section II shows the step-by-step modeling procedure to correlate SerDes model with measurement on bare package sample and the step-by-step modeling technique is validated up to 19 GHz. In section III, the details of measurement technique are discussed in order to guarantee the accuracy of measured data. In section IV, we present the SerDes design reference for operating at 5 GHz and 12.5 GHz depend on the differential insertion loss and near-end coupling performance of bare package and package on PCB in this study. Final are conclusions.
  • Keywords
    electronics packaging; printed circuit testing; PCB; SerDes link; SerDes signals; bare package sample; differential insertion loss; frequency 12.5 GHz; frequency 5 GHz; high speed SerDes design verification; measurement correlation; measurement technique; near end coupling performance; print circuit board; serial data link; step-by-step modeling; Couplings; Impedance; Insertion loss; Integrated circuit modeling; Loss measurement; Probes; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048438
  • Filename
    7048438