DocumentCode
3565972
Title
[Title page]
fYear
2014
Firstpage
1
Lastpage
1
Abstract
Presents the title page of the proceedings record.
Keywords
Assembly; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048464
Filename
7048464
Link To Document