Title :
Dimensional limitation of polymeric microfluidic platform for liquid metal manipulation
Author :
Daeyoung Kim ; Jun Hyeon Yoo ; Jeong-Bong Lee ; Wonjae Choi ; Koangki Yoo
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
Abstract :
We report a study on the minimum microfluidic channel dimension in which gallium-based liquid metal alloy can be filled. Based on the non-toxicity of gallium-based liquid metal, it was expected to be utilized in many applications. Specifically, in order to possess advantages of its liquid property, there are several efforts to use it in microfluidic-based applications. However, due to its high surface tension of the liquid metal, the applicable dimension of the microfluidic channel has been simply limited. In order to investigate the minimum channel dimension, we have fabricated three different thick (5, 10, and 25 μm) PDMS-based microfluidic channel with various widths in the range from 20 μm to 3 μm using SU-8 mold technique. We successfully filled the liquid metal into as small as 3 μm wide channel with 25 μm thickness which has a rectangle cross section of 75 μm2. As a demonstration of the filling of liquid metal, we transferred the shape of channel in which liquid metal is filled, to positive photoresist by liquid metal-based photolithography.
Keywords :
gallium alloys; liquid alloys; microchannel flow; photoresists; polymers; surface tension; PDMS-based microfluidic channel; SU-8 mold technique; channel shape; dimensional limitation; gallium-based liquid metal alloy; liquid metal manipulation; liquid metal-based photolithography; minimum channel dimension; minimum microfluidic channel dimension; polymeric microfluidic platform; positive photoresist; rectangle cross section; size 25 mum; size 3 mum to 20 mum; surface tension; Liquids; Lithography; Metals; Microfluidics; Resists; Shape; Galinstan®; gallium-based liquid metal alloy; injectable minimum channel dimension; microfluidic channel;
Conference_Titel :
Industrial Electronics Society, IECON 2014 - 40th Annual Conference of the IEEE
DOI :
10.1109/IECON.2014.7048829