DocumentCode
3566534
Title
2W Ku-band coplanar MMIC HPA using HBT for flip-chip assembly
Author
Fraysse, J.P. ; Vendier, O. ; Soulard, M. ; Auxemery, P.
Author_Institution
Alcatel Space Industries, Toulouse, France
Volume
1
fYear
2002
Firstpage
441
Abstract
A coplanar HBT MMIC amplifier in Ku-band for space applications is presented. This HPA is based on the commercial HB20P process of UMS adapted to flip-chip assembly. An output power closed to 2W has been measured over 10.5-12.2GHz frequency range with an associated PAE higher than 25% and an associated gain of 20dB. The coplanar technology (CPW) and flip-chip mounting impact on the HPA design is also described.
Keywords
MMIC power amplifiers; bipolar MMIC; coplanar waveguide components; flip-chip devices; heterojunction bipolar transistors; space vehicle electronics; 10.5 to 12.2 GHz; 2 W; 20 dB; 25 percent; CPW; Ku-band; UMS HB20P process; coplanar HBT MMIC high power amplifier; flip-chip assembly; gain; output power; power-added efficiency; space applications; Assembly; Coplanar waveguides; Frequency measurement; Gain measurement; Heterojunction bipolar transistors; MMICs; Power amplifiers; Power generation; Power measurement; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2002 IEEE MTT-S International
ISSN
0149-645X
Print_ISBN
0-7803-7239-5
Type
conf
DOI
10.1109/MWSYM.2002.1011650
Filename
1011650
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