• DocumentCode
    3567765
  • Title

    Comparison of duty-cycle effects at room temperature in SiON and HfO2 gate PMOS FETS

  • Author

    Nguyen, D.D. ; Kouhestani, C. ; Kambour, K.E. ; Bersuker, G. ; Devine, R.A.B.

  • Author_Institution
    COSMIAC, Albuquerque, NM, USA
  • fYear
    2014
  • Firstpage
    143
  • Lastpage
    146
  • Abstract
    The existence of multiple, physically distinct components of Negative Bias Temperature Instability requires a measurement methodology which allows the extraction of each component independently. In this paper we present results obtained at room temperature, which minimizes both the interface state and switching trap components, allowing us to explore the trapping of holes at preexisting defects in the oxide. This is done for both SiON and HfO2/SiO2 oxide stacks of similar total thickness. Results are presented for both pseudo-DC and pulse stressing including the dependence of the pulse measurements on duty cycle. A two trap model using the Tewksbury formalism is proposed to predict the results.
  • Keywords
    MOSFET; hafnium compounds; oxygen compounds; semiconductor device reliability; silicon compounds; HfO2-SiO2; PMOS FETS; SiON; Tewksbury formalism; duty-cycle effects; interface state; negative bias temperature instability; pulse measurements; switching trap components; temperature 293 K to 298 K; Hafnium compounds; Logic gates; Semiconductor device measurement; Stress; Temperature measurement; Threshold voltage; Voltage measurement; NBTI; oxide traps; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
  • Print_ISBN
    978-1-4799-7308-8
  • Type

    conf

  • DOI
    10.1109/IIRW.2014.7049531
  • Filename
    7049531