Title :
Low-k interconnect discussion session
Abstract :
Options for RC Mitigation are limited but the end is not near! The discussion group´s consensus: • Resistance Scaling: — Cu (with TaN/Ta barrier) is near the end. — Aluminum looks attractive again. • Capacitance Scaling: — Going lower-k is really hard! — Incorporating Air-gaps (along with subtractive Al) offers promise.
Keywords :
Air gaps; Aluminum; Capacitance; Manufacturing; Resistance;
Conference_Titel :
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN :
978-1-4799-7308-8
DOI :
10.1109/IIRW.2014.7049542
