• DocumentCode
    3568
  • Title

    Fabrication of Optically Transparent PDMS Artificial Lotus Leaf Film Using Underexposed and Underbaked Photoresist Mold

  • Author

    Youngsam Yoon ; Dong-weon Lee ; Jeong-Bong Lee

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • Volume
    22
  • Issue
    5
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    1073
  • Lastpage
    1080
  • Abstract
    We report an extremely simple method of making an optically transparent superhydrophobic polydimethyl-siloxane (PDMS) thin film using underexposed and underbaked positive photoresist (PR) mold. Significant under soft-bake condition makes PR retain good amount of solvents, which greatly increases the dissolution rate of the PR during developing. A combination of optimal underbaking and underexposure condition created a unique hierarchical micro-/nano- structure on the PR mold, and inverse image of the PR mold was replicated to create a hierarchical micro/nano structured broccoli-shaped PDMS thin film. A 100-nm-thick fluorocarbon film was optionally deposited on the broccoli-shaped PDMS film to further enhance superhydrophobicity. Advancing and receding angles of the film for 4- μL water droplet were found to be 161.33±0.763° and 133.33±0.29°, respectively, showing superhydrophobicity. It was also found that the optical transmittance at around 550 nm for this PDMS film was approximately 90%.
  • Keywords
    hydrophobicity; microfabrication; moulding; nanofabrication; nanolithography; photoresists; polymers; artificial lotus leaf film; broccoli shaped PDMS thin film; fluorocarbon film; hierarchical microstructure; hierarchical nanostructure; optically transparent PDMS fabrication; optimal underbaking; size 100 nm; soft bake condition; superhydrophobic polydimethyl siloxane thin film; underbaked photoresist mold; underexposed photoresist mold; underexposure condition; PDMS; superhydrophobicity; underbaking; underexposure;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2013.2264729
  • Filename
    6544608