Title :
Coupled circuit-electromagnetic simulation with time domain integral equations
Author :
Chuanyi Yang ; Jandhyala, V.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Abstract :
Time domain electromagnetic solvers are useful for simulating coupled circuit-electromagnetic (EM) problems involving integrated circuit packages and systems-on-chip, wherein effects of nonlinearities of circuit elements can be modeled accurately. The surface-based time domain integral equation (TDIE) approach has been gaining in popularity owing to its flexibility in modeling arbitrarily-shaped structures and its enhanced computational performance due to advances in fast solution methods. In this work, a generalized rigorous coupling scheme, to simultaneously simulate circuits with SPICE-like time-domain simulation, and EM interactions with a TDIE method, is presented. This approach enables direct solution of circuit-EM equations without the need for generating port models. The method permits both circuit and EM excitations and thereby has potential as a signal integrity and as an EMI/EMC modeling tool.
Keywords :
circuit simulation; computational electromagnetics; coupled circuits; electromagnetic compatibility; electromagnetic interference; integral equations; EM excitations; EM interactions; EMC; EMI; SPICE-like time-domain simulation; TDIE; arbitrarily-shaped structures; coupled circuit-electromagnetic simulation; signal integrity modeling; surface-based time domain integral equations; time domain electromagnetic solvers; Circuit simulation; Computational modeling; Coupling circuits; Electromagnetic coupling; Electromagnetic interference; Electromagnetic modeling; Integral equations; Integrated circuit modeling; Integrated circuit packaging; Time domain analysis;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1219851