DocumentCode :
3568619
Title :
A fully integrated Doherty-amplifier for 5.6 GHz WLAN applications
Author :
Tzschoppe, Christoph ; Wolf, Robert ; Fritsche, David ; Richter, Alexander ; Ellinger, Frank
fYear :
2014
Firstpage :
72
Lastpage :
75
Abstract :
In this paper, a fully integrated Doherty power amplifier (DPA) for application in IEEE 802.11a wireless local area network (WLAN) transmitters is proposed. The DPA exhibits an output power at its 1 dB compression point of 22 dBm with a corresponding power added efficieny (PAE) of 25 %. Within a 6dB-backoff the PAE is still 20 %, which among the highest reported for Doherty amplifiers fully integrated in silicon. The input reflection coefficient is less than -15 dB while the maximum forward transmission is 12.5 dB. This Doherty amplifier shows a low phase variation of only 16° over an input dynamic range of 30 dB. To verify the performance the DPA is measured with an orthogonal frequency divison multiplexed (OFDM) signal with 52 carriers using 16 QAM modulation scheme and a carrier frequency of 5.6 GHz. Error vector magnitudes are measured for different input power levels. The circuit is implemented in IHP 250nm-SiGe-BiCMOS technology and needs a 2.5 V supply. The chip area is 1.54 mm2 × 0.85 mm2 including the pads and eleven integrated inductors.
Keywords :
BiCMOS integrated circuits; OFDM modulation; radio transmitters; radiofrequency power amplifiers; wireless LAN; 16 QAM modulation scheme; BiCMOS technology; DPA; Doherty power amplifier; IEEE 802.11a wireless local area network transmitters; IHP; OFDM; PAE; SiGe; WLAN applications; frequency 5.6 GHz; integrated inductors; orthogonal frequency divison multiplexed; power added efficieny; reflection coefficient; size 0.85 mm; size 1.54 mm; size 250 nm; voltage 2.5 V; Frequency measurement; Impedance; OFDM; Power generation; Semiconductor device measurement; Vectors; Wireless LAN; BiCMOS integrated circuits; OFDM; Peak to average power ratio; Power amplifiers; Wireless LAN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
Type :
conf
DOI :
10.1109/ICECS.2014.7049924
Filename :
7049924
Link To Document :
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