Title :
Sizing of the physical layer of a RF intra-chip communications
Author :
Hamieh, Mohamad ; Ariaudo, Myriam ; Quintanel, Sebastien ; Louet, Yves
Author_Institution :
ETIS/ENSEA, Univ. of Cergy-Pontoise, Cergy-Pontoise, France
Abstract :
In this paper we size a RF intra-chip communications based on Orthogonal Frequency Division Multiple Access (OFDMA) modulation which allows data rate and message recipient reconfiguration. Firstly, we present the advantages of this modulation such as providing flexible and high-speed data transmission. Then, we study the impact of the RF-interconnect channel shape on the transmission in terms of required transmission power. Finally, we present the effect of the channel composed of the line and its multiple access on the transfer of information and we perform a channel equalization to overcome this undesired effect.
Keywords :
OFDM modulation; frequency division multiple access; network-on-chip; radiofrequency integrated circuits; OFDMA modulation; RF intrachip communications; RF-NoC interconnection; RF-interconnect channel shape; channel equalization; data rate reconfiguration; flexible high-speed data transmission; information transfer; message recipient reconfiguration; network-on-chip; orthogonal frequency division multiple access modulation; physical layer sizing; power transmission; Binary phase shift keying; Integrated circuit interconnections; Power transmission lines; Radio frequency; Receivers; Shape; OFDMA modulation; RF-NoC; Transmission optimization;
Conference_Titel :
Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
DOI :
10.1109/ICECS.2014.7049947