Title :
Area reduction on interconnect optimized floorplan using deadspace utilization
Author :
Sham, Chiu-Wing ; Young, Evangeline F Y
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
Abstract :
Interconnect optimization has become the major concern in floorplanning. Many approaches would use simulated annealing (SA) with a cost function composed of a weighted sum of area, wirelength and interconnect cost. These approaches can reduce the interconnect cost efficiently but the area penalty of the interconnect optimized floorplan is usually quite large. In this paper, we propose a new approach called deadspace utilization (DSU) to reclaim the unused area of an interconnect optimized floorplan by linear programming. Since modules are not necessarily rectangular in shape in floorplanning, some deadspace can be redistributed to the modules to increase the area occupied by the modules. If the area of each module can be expanded by the same ratio, the whole floorplan can be compacted by that ratio to give a smaller floorplan. In addition, we can limit the compaction ratio to prevent over-congestion. Experiments show that we can apply this deadspace utilization technique to reduce the area and wirelength of an interconnect optimized floorplan further while the constraint on routability and congestion can be maintained at the same time.
Keywords :
circuit optimisation; integrated circuit interconnections; integrated circuit layout; linear programming; simulated annealing; area reduction; compaction ratio; cost function; deadspace utilization; interconnect cost; interconnect optimized floorplan; linear programming; over congestion prevention; simulated annealing; Compaction; Computational modeling; Computer science; Constraint optimization; Cost function; Integrated circuit interconnections; Linear programming; Shape; Simulated annealing; Very large scale integration;
Conference_Titel :
Circuits and Systems, 2004. MWSCAS '04. The 2004 47th Midwest Symposium on
Print_ISBN :
0-7803-8346-X
DOI :
10.1109/MWSCAS.2004.1354023