DocumentCode :
3569065
Title :
Investigation of the morphology in AlN filled epoxy based composite materials
Author :
Andritsch, Thomas ; Sixiang Zhang ; Kochetov, Roman
Author_Institution :
Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
fYear :
2015
Firstpage :
321
Lastpage :
324
Abstract :
This paper investigates the structure of bisphenol-A epoxy based composites with low amounts of aluminium nitride (from 0.5 to 10 % by weight), which were originally chosen for their high thermal conductivity. Aim of this research was to investigate the applicability of interphase models on amorphous thermosets. The filler content was confirmed with thermogravimetric analysis, and previous measurements of the dielectric properties re-examined. The results of transmission electron microscopy and differential scanning calorimetry suggest that epoxy based insulation materials don´t exhibit distinct interfacial restructuring on the nanoscale, but rather a widespread change of the micro structure, even for smallest amounts of additives.
Keywords :
additives; aluminium compounds; differential scanning calorimetry; filled polymers; permittivity; polymer structure; thermal conductivity; transmission electron microscopy; AIN filled epoxy based composite materials; additives; amorphous thermosets; bisphenol-A epoxy based composite structure; dielectric properties; differential scanning calorimetry; epoxy based insulation materials; interphase models; microstructure; morphology; thermal conductivity; thermogravimetric analysis; transmission electron microscopy; Dielectrics; Moisture measurement; Permittivity; Plastics; DSC; TGA; composite materials; epoxy resin; interphase; nanodielectrics; polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2015 IEEE
Print_ISBN :
978-1-4799-7352-1
Type :
conf
DOI :
10.1109/ICACACT.2014.7223518
Filename :
7223518
Link To Document :
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