DocumentCode
356910
Title
Effect of a limit to the figure-of-merit on thermoelectric generation
Author
Rowe, D.M. ; Min, Gao ; Kuuletsov, V. ; Kaliazin, A.
Author_Institution
Div. of Electron. Eng., Univ. of Wales Cardiff, UK
Volume
1
fYear
2000
fDate
2000
Firstpage
128
Abstract
Evidence is presented which indicates that the dimensionless figure-of-merit (ZT) of a thermoelectric material has a limit of around 2. In this paper, the consequences of the existence of this limit in material performance, on the development of thermoelectric technology is discussed. It is concluded that in specialised applications where efficiency, device compactness and field costs are major considerations, the existence of this low material performance limit may well have a capping effect on the planning of future advanced material development programmes. However, in applications where the cost of fuel is low or essentially free, as in waste heat recovery, the economic factor (cost per watt) rather than efficiency, is the overriding consideration. In such applications, a limit to ZT will have only a marginal impact on the competitiveness of thermoelectrics as an environmentally friendly source of electrical power. Alternative strategies for effectively increasing the conversion efficiency of thermoelements are discussed
Keywords
economics; thermal analysis; thermoelectric conversion; advanced material development programmes; applications; competitiveness; device compactness; economic factor; efficiency; environmentally friendly; field costs; figure-of-merit limit effect; material performance; thermoelectric generation; thermoelectric material; thermoelectric technology development; thermoelements conversion efficiency; waste heat recovery; Conducting materials; Costs; Fuels; Germanium silicon alloys; Heat engines; Lattices; Resistance heating; Silicon germanium; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Engineering Conference and Exhibit, 2000. (IECEC) 35th Intersociety
Conference_Location
Las Vegas, NV
Print_ISBN
1-56347-375-5
Type
conf
DOI
10.1109/IECEC.2000.870646
Filename
870646
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