DocumentCode
3569487
Title
Defect Detection Rate through IDDQ for Production Testing
Author
Hirase, Junichi
Author_Institution
Japan Sci. & Technol. Agency
fYear
2008
Firstpage
199
Lastpage
205
Abstract
With the miniaturization of the diffusion process, the leak current per transistor tends to increase and the number of transistors per die tends to become larger, thus rendering more difficult the discrimination through the absolute value of IDDQ (quiescent power supply current) that is required to detect defects on VLSI (Very Large Scale Integration). While various statistical methods have been disclosed, this paper describes first the effects of an increase in the average value of IDDQ due to process dispersion on the IDDQ distribution and presents a theorization to estimate the defect detection rate of various IDDQ testing methods. Corroborative results will then show the validity of the presented theory on the defect detection rate of IDDQ.
Keywords
VLSI; design for testability; diffusion; flaw detection; integrated circuit design; integrated circuit testing; production testing; IDDQ testing; VLSI; defect detection rate; design-for-testability; diffusion process; process dispersion; production testing; quiescent power supply current; very large scale integration; Current supplies; Diffusion processes; Dispersion; Estimation theory; Leak detection; Power supplies; Production; Statistical analysis; Testing; Very large scale integration; Defect detection rate; Exponential distribution; Gamma distribution; IDDQ; Performance index; Product of average defective current;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2008. ATS '08. 17th
ISSN
1081-7735
Print_ISBN
978-0-7695-3396-4
Type
conf
DOI
10.1109/ATS.2008.88
Filename
4711584
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