DocumentCode :
3569692
Title :
Considerations for efficient contact resistivity reduction via Fermi Level depinning - impact of MIS contacts on 10nm node nMOSFET DC characteristics
Author :
Borrel, J. ; Hutin, L. ; Rozeau, O. ; Batude, P. ; Poiroux, T. ; Nemouchi, F. ; Vinet, M.
Author_Institution :
STMicroelectron., Crolles, France
fYear :
2015
Abstract :
In the overwhelming majority of cases, current-voltage characteristics of metal-based contacts on semiconductors are non-linear around 0V even for degenerate interfacial doping levels. Any contact resistivity specification is therefore meaningless without the knowledge of the effective bias across the contact. For the first time, the efficiency of a dielectric insertion for contact resistance reduction was properly evaluated by solving the self-consistent case of voltage sharing for an aggressively scaled transistor flanked by two trench Metal/ Insulator/Semiconductor (MIS) contacts. We found that leveraging the Fermi Level depinning via optimized MIS contacts could lead to a +92% drive current (VGS=Vdd=0.7V) increase versus a Titanium liner-based silicidation-free approach.
Keywords :
Fermi level; MIS structures; MOSFET; electrical resistivity; Fermi level depinning; MIS contacts; current-voltage characteristics; dielectric insertion; efficient contact resistivity reduction; metal based contacts; nMOSFET DC characteristics; size 10 nm; trench metal- insulator-semiconductor contact; Dielectrics; Junctions; Metals; Ohmic contacts; SPICE; Silicon; Zirconium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSI Technology), 2015 Symposium on
ISSN :
0743-1562
Type :
conf
DOI :
10.1109/VLSIT.2015.7223710
Filename :
7223710
Link To Document :
بازگشت