Title :
Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules
Author :
Dugal, F. ; Ciappa, M.
Author_Institution :
Semicond., ABB Switzerland Ltd., Lenzburg, Switzerland
Abstract :
High power modules are still facing the challenges to increase their power output, increase the junction temperature, and increase their reliability in harsh conditions. Therefore in the full paper from this study a detail analysis of this solder joint was reported [1]. The intermetallic phases and the microstructure of standard chip to substrate solder joint will be analysed and compared to deteriorated joints coming from modules which have undergone an active thermal cycling.
Keywords :
ageing; lead alloys; microassembling; modules; silver alloys; solders; tin alloys; PbSnAg; die attach solder joint; high power module; intermetallic phase; temperature aging; thermal cycling; Delamination; Intermetallic; Optical microscopy; Scanning electron microscopy; Soldering; X-ray imaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
DOI :
10.1109/IPFA.2015.7224318
