DocumentCode
3571491
Title
Reconfigurable micro-assembly system for photonics applications
Author
Popa, Dan ; Kang, Byoung Hun ; Sin, Jeongsik ; Zou, Jie
Author_Institution
Rensselaer Polytechnic Institute
Volume
2
fYear
2002
Firstpage
1495
Lastpage
1500
Abstract
The assembly of parts with dimensions several hundred microns or less is a challenging problem, and has received increasing attention for applications in areas such as telecommunication, automotive, and biotechnology. Current state of the art micro-assembly systems are often specialized devices and software. In this paper we present a reconflgurable assembly system designed to handle micro-parts in such a way that high precision actuation and sensing is used only in the subsystems where it is actually necessary. Aspects related to part gripping, fucturing, sensing, motion and bonding are discussed. Analysis and experiments are presented to show that this architecture can lead to a relatively low cost and flexible assembly solution.
Keywords
Assembly systems; Bonding; Control systems; Costs; Curing; Fixtures; Micromechanical devices; Motion control; Photonics; Robotic assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation, 2002. Proceedings. ICRA '02. IEEE International Conference on
Print_ISBN
0-7803-7272-7
Type
conf
DOI
10.1109/ROBOT.2002.1014755
Filename
1014755
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