مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3572396

Title :

The Future for Multichip Modules

Author :

Sage, M.G.

Author_Institution :

BPA Ltd, Surrey, United Kingdom

fYear :

1992

Firstpage :

517

Lastpage :

517

Keywords :

Assembly systems; Design engineering; Microelectronics; Multichip modules; System testing; Technological innovation;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European

Print_ISBN :

444894780

Type :

conf

Filename :

5435151

Link To Document :