Title :
Limitations of Electrical Interconnections in Electronic Systems
Author_Institution :
Corporate Research and Development, SIEMENS AG, Munich F.R.G.
Keywords :
Bandwidth; Delay effects; Electronics packaging; Geometry; Integrated circuit interconnections; Lead compounds; Microelectronics; Research and development; Semiconductor device reliability; Wiring;
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European