A Low Cost Bumping Process For Flip Chip-technology Using Electroless Nickel Bumping And Solder Ball Placement

fYear

1997

Firstpage

174

Lastpage

181

Keywords

Adhesives; Costs; Flip chip; Gold; Nickel; Parallel processing; Sputtering; Substrates; Surface-mount technology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619000

Link To Document