DocumentCode :
3573835
Title :
Analysis of Leakage Currents in Smart Power Devices
Author :
Knaipp, M. ; Simlinger, T. ; Kanert, W. ; Selberherr, Siegfried
Author_Institution :
Institute for Microelectronics, TU Vienna, Gusshausstrasse 27-29, A-1040 Vienna, Austria
fYear :
1996
Firstpage :
645
Lastpage :
648
Abstract :
The Smart Power Device under consideration is a buried layer device which is widely used in industry. An n-doped epitaxy layer is grown on a highly n-doped buried layer. This layer is placed on the p-substrate. The epitaxy-and buried layers are surrounded by a double diffused p-isolation. The leakage currents between the epitaxy layer and the isolation are simulated and measured in a temperature range from 300 K to 500 K.
Keywords :
Automotive engineering; Current measurement; Doping profiles; Epitaxial growth; Isolation technology; Leakage current; Manufacturing industries; Semiconductor process modeling; Temperature distribution; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Print_ISBN :
286332196X
Type :
conf
Filename :
5436103
Link To Document :
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