Title :
Thermal Stress Simulation Of Electronic Device By Boundary Element Method
Author :
Yasutake, Kenji ; Shinki, Yutaka ; Ohtani, Yusuke
Keywords :
Analytical models; Boundary element methods; Electronic packaging thermal management; Integral equations; Mesh generation; Numerical analysis; Poisson equations; Solid modeling; Thermal conductivity; Thermal stresses;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Print_ISBN :
0-7803-4235-6
