Title :
Table of contents
Abstract :
The following topics are dealt with: electromagnetic phenomena; reliability characterization; sensors; actuators; microfluidics; MEMS packaging; and MEMS fabrication.
Keywords :
actuators; microfabrication; microfluidics; packaging; sensors; MEMS fabrication; MEMS packaging; actuator; electromagnetic phenomena; microelectromechanical system; microfluidic; reliability characterization; sensor; Fabrication; Micromechanical devices; Nanoscale devices; Publishing; Thermal force; Thermal sensors; Thermal stresses;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056627
