Characterization of capacitive micromachined ultrasonic transducers

Author

Lardies, Joseph ; Bellared, Faycal ; Belgacem, Brahim ; Bourbon, Gilles ; Le Moal, Patrice ; Walter, Vincent

Author_Institution

Inst. FEMTO-ST, Besançon, France

fYear

2014

Firstpage

1

Lastpage

6

Abstract

This communication describes numerical and experimental characterization of CMUTs for ultrasound transmission. Simulations based on finite elements method to model CMUTs electromechanical behaviour and to determine the dimensions of elementary cells are presented. In particular we analyze the collapse voltage variations for different parameters of a circular cell and the capacitance variations for different bias voltages. We report the deformations of non-metallized and metallized membranes and we determine eigenfrequencies, bandwidth and quality factors of cells. The fabrication of CMUTs is based on the anodic bonding of a SOI wafer on a borosilicate glass substrate and we compare experimental results with numerical results.

Keywords

anodisation; bonding processes; capacitance measurement; capacitive sensors; deformation; membranes; micromachining; microsensors; ultrasonic transducers; CMUT; SOI wafer; anodic bonding; borosilicate glass substrate; capacitive micromachined ultrasonic transducer; circular cell; eigenfrequency; electromechanical behaviour; elementary cell; finite element method; metallized membrane deformation; nonmetallized membrane deformation; numerical characterization; ultrasound transmission; Bandwidth; Capacitance; Electrodes; Finite element analysis; Resonant frequency; Silicon; Voltage measurement; CMUTs; capacitance variations; collapse voltage; fill factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on

Print_ISBN

978-2-35500-028-7

Type

conf

DOI

10.1109/DTIP.2014.7056635

Filename

7056635