A dual-axis MEMS inertial sensor using multi-layered high-density metal for an arrayed CMOS-MEMS accelerometer

Author

Yamane, Daisuke ; Matsushima, Takaaki ; Konishi, Toshifumi ; Toshiyoshi, Hiroshi ; Machida, Katsuyuki ; Masu, Kazuya

Author_Institution

Solution Res. Lab., Tokyo Inst. of Technol., Tokyo, Japan

fYear

2014

Firstpage

1

Lastpage

4

Abstract

This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS process. Due to the high density of gold, the Brownian noise on the proof mass becomes lower than those made of other materials in the same size. The miniaturized MEMS accelerometer can be integrated in an arrayed CMOS-MEMS accelerometer to detect a broad range of acceleration on a single sensor chip.

Keywords

CMOS integrated circuits; accelerometers; electroplating; gold; microsensors; Au; Brownian noise; arrayed CMOS-MEMS accelerometer; dual-axis MEMS inertial sensor; multilayered electroplated gold; multilayered high-density metal; post-CMOS process; proof mass; single sensor chip; Acceleration; Accelerometers; Capacitance; Capacitance measurement; Micromechanical devices; Semiconductor device measurement; Sensors; CMOS-MEMS; accelerometer; electroplating; inertial sensor; post-CMOS process;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on

Print_ISBN

978-2-35500-028-7

Type

conf

DOI

10.1109/DTIP.2014.7056643

Filename

7056643