• DocumentCode
    3574961
  • Title

    Nanomechanical and nanotribological characterization of a MEMS micromembrame supported by two folded hinges

  • Author

    Pustan, Marius ; Dudescu, Cristian ; Birleanu, Corina

  • Author_Institution
    Micro & Nano Syst. Lab., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Experimental investigations, analytical and numerical studies of a micromembrane supported by two folded hinges are presented in this paper. This micromembrane can be used as a flexible component in RF-MEMS switches or in optical applications. The experimental tests are performed to determine the micromembrane behavior under a mechanical loading. Mechanical properties under interest are the bending stiffness, and stress. Tribological investigation implies adhesion measurement between the flexible part of micromembrane and substrate. The gap between micromembrane and substrate is 3 μm in the same range with the sample thickness. The adhesion force depends on the geometrical configuration of micromembrane hinges, is influenced by the material properties and the roughness of contact surfaces. Stiction is one of the main failure causes of a micromembrane that deflects directly to substrate. The other failure cause is the excessive stress in the micromembrane hinges. Analysis of the micromembrane stress behavior under large deflection is numerically investigated.
  • Keywords
    adhesion; hinges; membranes; micromechanical devices; stiction; adhesion force; adhesion measurement; bending stiffness; contact surfaces roughness; folded hinges; geometrical configuration; material properties; mechanical loading; mechanical properties; micromembrane hinges; micromembrane stress; stiction; tribological investigation; Fasteners; Force; Mobile communication; Optical attenuators; Probes; Stress; Substrates; atomic force microscopy; micromembranes; stiction; stiffness; stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056648
  • Filename
    7056648