Title :
Characterization of Cu-Sn SLID interconnects for harsh environment applications
Author :
Campos-Zatarain, A. ; Flynn, D. ; Aasmundtveit, K.E. ; Hoivik, N. ; Wang, K. ; Liu, H. ; Luu, T.T. ; Mirgkizoudi, M. ; Kay, R.W.
Author_Institution :
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
Abstract :
This paper reports on the results obtained from performing "shake and bake" testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.
Keywords :
copper alloys; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; lead bonding; soldering; tin alloys; Cu-Sn; SLID interconnect; downhole applications; gas industry; harsh environment applications; oil industry; shake and bake testing; solid liquid interdiffusion bonding; thermal loading; vibration loading; Bonding; Loading; Silicon carbide; Testing; Thermal loading; Tin; Vibrations; "shake and bake"; Cu-Sn; SLID; bonding; harsh environment; high-temperature;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056665
