Title :
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Author :
Lucibello, A. ; Capoccia, G. ; Proietti, E. ; Marcelli, R. ; Margesin, B. ; Mulloni, V. ; Giacomozzi, F. ; Vitulli, F. ; Scipioni, M. ; Bartolucci, G.
Author_Institution :
Inst. for Microelectron. & Microsyst., IMM Roma, Rome, Italy
Abstract :
Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.
Keywords :
ceramic packaging; microswitches; redundancy; thermal stresses; RF MEMS LTCC packaged switch; ground characterization; low temperature cofired ceramic packaging; mechanical stress; radiofrequency microelectromechanical system switch; redundancy logic; space component; thermal stress; Insertion loss; Micromechanical devices; Packaging; Performance evaluation; Radio frequency; Redundancy; RF MEMS; redundancy; reliability; space components;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056679
