• DocumentCode
    3575128
  • Title

    SmartMig: A Case for Page Migration and Self-Interleaving for On-Chip Distributed Memory Systems

  • Author

    Weiwei Fu ; Mingmin Yuan ; Tianzhou Chen ; Qingsong Shi ; Li Liu ; Minghui Wu

  • Author_Institution
    Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
  • fYear
    2014
  • Firstpage
    701
  • Lastpage
    704
  • Abstract
    This paper tries to optimize the placements of data pages, which have a strong impact on system performance. We find that both core-to-memory distance and contention on MCs and interconnects are critical. Migrating pages to their page access center can mini-mize average memory access distance, but may cause serious contention and congestion, necessitating further schemes for load balancing. Based on these observations, we propose a novel runtime mechanism called SmartMig, in which we mi-grate data pages to shorten memory access distance, while employ page self-interleaving to balance the load across the nodes. We propose models and algorithms to decide the fate of candidate pages. Simulation results show that SmartMig achieves performance improvements by 26.9% and 21.0% in terms of normalized IPC and average memory access latency, which is a result of significant reduction of core-to memory distance and load in balance.
  • Keywords
    distributed memory systems; paged storage; storage management; SmartMig; core-to-memory distance; load balancing; memory access distance; memory access latency; on-chip distributed memory system; page migration; page self-interleaving; runtime mechanism; Conferences; Educational institutions; Load management; Load modeling; Routing; Runtime; System-on-chip; Data placement; Migration; On-chip distributed memory systems; Self-interleaving;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computing and Communications, 2014 IEEE 6th Intl Symp on Cyberspace Safety and Security, 2014 IEEE 11th Intl Conf on Embedded Software and Syst (HPCC,CSS,ICESS), 2014 IEEE Intl Conf on
  • Print_ISBN
    978-1-4799-6122-1
  • Type

    conf

  • DOI
    10.1109/HPCC.2014.123
  • Filename
    7056819