Title :
Application of image processing and recognition technology on the automatic test platform of electronic products
Author :
Yanhua Cheng ; Jingli Lu ; Sheng Cheng ; Jianwei Zhang
Author_Institution :
Kunshan Ind. Technol. Res. Inst., Jiangsu, China
Abstract :
The automatic testing platform of electronic products is a key equipment for electronic product production test automation. And the visual detection is the core technology of the testing platform. This paper mainly gathers the screen image of electronic products and analyzes the image feature, then uses the image processing functions of smoothing filtering, threshold segmentation, edge detection, seed filling, feature extraction, pattern recognition and so on to process the image and realize automatic testing of electronic products. As an innovatively application of this paper, the efficiency of the ways of detecting LCD screen miscellaneous points with seed filling, the automatic test system for electronic products with image processing, character recognition, voice detection integrated as well as the Tesseract OCR applied to screen character recognition have been notably improved. Practice has proved that this method is fast and practical in automatic testing.
Keywords :
edge detection; electronic products; feature extraction; image segmentation; production engineering computing; production testing; LCD screen miscellaneous points; Tesseract OCR; automatic testing platform; edge detection; electronic product production test automation; feature extraction; image processing; image recognition technology; pattern recognition; screen character recognition; seed filling; smoothing filtering; threshold segmentation; visual detection; voice detection; Automatic testing; Filling; Image color analysis; Image edge detection; Optical character recognition software; Tesseract OCR; automatic testing platform; image processing; seed filling; template matching;
Conference_Titel :
Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2014 International Conference on
DOI :
10.1109/3M-NANO.2014.7057304