Co-planar proximity fed nanofilm microstrip antenna: Modeling and simulation analysis

Author

Patil, Rajendra R. ; Hunagund, P.V. ; Vani, R.M.

Author_Institution

Dept. of Appl. Electron., Gulbarga Univ., Gulbarga, India

fYear

2014

Firstpage

253

Lastpage

256

Abstract

This paper presents modeling and simulation characterization of a co-planar proximity fed patch antenna that utilizes copper nanofilm (thickness: 1-100 nm) as a radiating element using IE3D simulation software. On a 1.6 mm height FR4 substrate, the proposed antenna resonates at 6.2 GHz and 9.8 GHz, with an impedance bandwidth of 10.53 GHz. The results are compared with 17 micron bulk copper patch antenna. The nanofilm antenna presents a wide bandwidth and higher return loss over bulk patch antenna. The antenna design, nanofilm thickness modeling, antenna simulation and results are discussed. The proposed antenna can be realized using nanotechnology systems like PVD, CVD, RF sputtering etc by depositing nano level thickness metals on FR4 substrate.

Keywords

broadband antennas; copper; microstrip antennas; microwave antennas; multifrequency antennas; CVD sputter etching; Cu; FR4 substrate; IE3D simulation software; PVD sputter etching; RF sputter etching; bandwidth 10.53 GHz; coplanar microstrip antenna; copper nanofilm; frequency 6.2 GHz; frequency 9.8 GHz; nanofilm microstrip antenna; nanotechnology systems; nanothick metal deposition; patch antenna; proximity fed microstrip antenna; radiating element; size 1 nm to 100 nm; size 1.6 mm; wideband antenna; Antenna feeds; Antenna radiation patterns; Bandwidth; Microstrip antennas; Patch antennas; Substrates; Co-planar proximity fed patch antenna; nanofilm; nanotechnology; wide bandwidth;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits, Communication, Control and Computing (I4C), 2014 International Conference on

Print_ISBN

978-1-4799-6545-8

Type

conf

DOI

10.1109/CIMCA.2014.7057800

Filename

7057800