DocumentCode
357634
Title
Analysis of the scattering and radiation features of 3D arbitrarily shaped conducting and dielectric bodies based on a novel boundary integral equation approach
Author
Burghignoli, P. ; Di Nallo, C. ; Frezza, F. ; Galli, A.
Author_Institution
Dept. of Electron. Eng., Rome Univ., Italy
Volume
3
fYear
2000
fDate
16-21 July 2000
Firstpage
1822
Abstract
An original boundary integral equation approach is developed for an efficient and accurate electromagnetic analysis of arbitrarily-shaped three-dimensional conducting and dielectric structures, typically involved in scattering and antenna problems. A suitable analytical pre-processing on the field integral representation allows a straightforward implementation of the Nystrom method, which is based on a direct discretization of the surface integrals by means of two-dimensional quadrature formulas: this novel approach is alternative to the more common moment-method solutions and presents various attractive computational advantages. Numerical results have been derived for canonical 3D shapes to validate the proposed implementation, confirming the excellent features of versatility, efficiency, and accuracy of this numerical tool.
Keywords
boundary integral equations; conducting bodies; dielectric bodies; electromagnetic wave scattering; 3D arbitrarily shaped conducting bodies; 3D arbitrarily shaped dielectric bodies; EM wave scattering; Nystrom method; antenna problems; boundary integral equation; canonical 3D shapes; conducting structures; dielectric structures; electromagnetic analysis; field integral representation; radiation features; scattering features; surface integrals discretization; two-dimensional quadrature formulas; Dielectrics; Electromagnetic analysis; Electromagnetic scattering; Green´s function methods; Integral equations; Magnetic analysis; Magnetic resonance; Message-oriented middleware; Shape; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2000. IEEE
Conference_Location
Salt Lake City, UT, USA
Print_ISBN
0-7803-6369-8
Type
conf
DOI
10.1109/APS.2000.874599
Filename
874599
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