Title :
A study on the optimization of wafer pre-treatment conditions for thin film stability monitor
Author :
Gong, Taicheng Kevin ; Yu, Yanju Lisa ; Cao, Yan Kaily ; Zhang, Xueliang Ruben ; Chang, Kaiyuan Kevin ; Chien, Weiting Kary
Author_Institution :
Corp. Q&R Center, Semicond. Manuf. Int. Corp., Shanghai, China
Abstract :
In this paper, an effective baking methodology to remove thin film stability monitor wafer surface contamination is reported. We consider baking temperature, baking time, and time interval between baking and measurement as three key factors for methodology optimization study. A long-time and durative experiment is designed for the obtaining of a suitable and feasible baking condition, in which design of experiment (DOE) is applied for the data analysis and the study of baking effect on wafer thickness change. From DOE analysis, we Anally take the baking condition of 140/ 60/210 as the optimal pre-treatment condition to monitor the stability of thickness metrology tools.
Keywords :
design of experiments; optimisation; semiconductor industry; semiconductor technology; thickness measurement; DOE; baking temperature; baking time; data analysis; design of experiment; semiconductor industry; thickness metrology tool; thin film stability monitor; time interval; wafer pretreatment condition optimization; wafer surface contamination; Films; Market research; Monitoring; Stability analysis; Temperature measurement; Temperature sensors; Thermal stability; Baking; DOE; Metrology Tool; Stability;
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2014 IEEE International Conference on
DOI :
10.1109/IEEM.2014.7058757
