A study on the optimization of wafer pre-treatment conditions for thin film stability monitor

In this paper, an effective baking methodology to remove thin film stability monitor wafer surface contamination is reported. We consider baking temperature, baking time, and time interval between baking and measurement as three key factors for methodology optimization study. A long-time and durative experiment is designed for the obtaining of a suitable and feasible baking condition, in which design of experiment (DOE) is applied for the data analysis and the study of baking effect on wafer thickness change. From DOE analysis, we Anally take the baking condition of 140/ 60/210 as the optimal pre-treatment condition to monitor the stability of thickness metrology tools.