Title :
Tightly integrated board level free space optical interconnects
Author_Institution :
Sch. of Eng., California Univ., San Diego, La Jolla, CA, USA
Abstract :
Free-space optical interconnects that use integrated VCSEL/MSM detector arrays can move data faster with lower power dissipation at the board level, and therefore have the potential to impact future router/switch and computer back-plane implementations. This paper summarizes some of the demonstration systems that were built by the 3-d OESP consortium to investigate experimentally the validity of these potentials.
Keywords :
electro-optical switches; metal-semiconductor-metal structures; optical backplanes; photodetectors; printed circuits; semiconductor laser arrays; surface emitting lasers; PCB motherboard; board level; computer back-plane implementations; free-space optical interconnects; integrated VCSEL/MSM detector arrays; lower power dissipation; router/switch implementations; tightly integrated board level free space optical interconnects; Bandwidth; Optical arrays; Optical interconnections; Optical receivers; Optical refraction; Optical switches; Optical transmitters; Photonics; Power dissipation; Very large scale integration;
Conference_Titel :
Lasers and Electro-Optics, 2001. CLEO/Pacific Rim 2001. The 4th Pacific Rim Conference on
Print_ISBN :
0-7803-6738-3
DOI :
10.1109/CLEOPR.2001.971140
