An optimization model of the stripline-to-stripline vertical interconnect in LTCC technology

Author

Yupeng Liu ; Lei Xia ; Ruimin Xu

Author_Institution

Fundamental Sci. on EHF Lab., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2014

Firstpage

12

Lastpage

13

Abstract

This paper presents a microwave stripline-to-stripline vertical interconnect in Low Temperature Co-fired Ceramic (LTCC) Technology. Two circular grooves are separately designed in the stripline lower ground plane and the stripline upper ground plane to reduce the insertion loss and improve the return loss. The mentioned structure has been simulated by HFSS. According to the simulation comparison results, the insertion loss can reduce 0.04 dB on average and the return loss can increase 17.5 dB on average over a band from 0.3 Ghz to 30 Ghz.

Keywords

ceramic packaging; integrated circuit interconnections; optimisation; strip lines; HFSS simulation; LTCC technology; circular grooves; frequency 0.3 GHz to 30 GHz; insertion loss; low temperature co-fired ceramic technology; optimization model; return loss; stripline lower ground plane; stripline upper ground plane; stripline-to-stripline vertical interconnect; Ceramics; Insertion loss; Integrated circuit interconnections; Microwave technology; Stripline; Substrates; Three-dimensional displays; LTCC; circular aperture; microstrip; stripline-to-stripline; vertical interconnect;

fLanguage

English

Publisher

ieee

Conference_Titel

Communication Problem-Solving (ICCP), 2014 IEEE International Conference on

Print_ISBN

978-1-4799-4246-6

Type

conf

DOI

10.1109/ICCPS.2014.7062203

Filename

7062203