Title :
A comparative study of three transmission line models for on-chip interconnects
Author :
Zonghua Zheng ; Kun Ren ; Lingling Sun ; Jun Liu
Author_Institution :
Inst. of VLSI Design, Zhejiang Univ., Hangzhou, China
Abstract :
In this paper, three effective transmission line (T-line) models are studied. One is the conventional frequency-dependent RLGC transmission line model which can think about the effect of skin effect and the dielectric-loss due to dielectric polarization and dipole rotation. The second is the fraction-order RLGC transmission line model which also considers the loss from frequency-dependent dispersion and non-quasi-static effects at Terahertz (THz) frequency band. Finally the third is the memory-dependent RLGC transmission line model through transfer function analysis, by comparing the poles and zeros of the transfer function of the equivalent circuit of the RLGC model, most of the parasitic effect including memory effect in THz frequency can be take into account. Three models are compared for on-chip coplanar waveguide (CPW) transmission lines over a wide frequency range from dc up to 67 GHz in SMIC 65 nm technology. And the memory-dependent model is much accurate than others.
Keywords :
CMOS integrated circuits; coplanar transmission lines; coplanar waveguides; dielectric losses; dielectric polarisation; skin effect; transfer functions; transmission line theory; SMIC 65 nm technology; T-line models; THz frequency band; dielectric polarization; dielectric-loss; dipole rotation; equivalent circuit; fraction-order RLGC transmission line model; frequency 67 GHz; frequency-dependent RLGC transmission line model; frequency-dependent dispersion; memory-dependent RLGC transmission line model; nonquasi-static effects; on-chip CPW transmission lines; on-chip coplanar waveguide transmission lines; parasitic effect; size 65 nm; skin effect; terahertz frequency band; transfer function analysis; transmission line models; Dielectrics; Fitting; Frequency measurement; Impedance; Integrated circuit modeling; Transmission line measurements; Vectors;
Conference_Titel :
Communication Problem-Solving (ICCP), 2014 IEEE International Conference on
Print_ISBN :
978-1-4799-4246-6
DOI :
10.1109/ICCPS.2014.7062286