DocumentCode :
357848
Title :
Modeling of electromagnetic interference to an implanted cardiac pacemaker due to mobile phones
Author :
Wang, Jianqing ; Fujiwara, Osamu
Author_Institution :
Dept. of Electr. & Comput. Eng., Nagoya Inst. of Technol., Japan
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
209
Abstract :
Modeling the electromagnetic interference (EMI) of pacemakers due to mobile phones is essential to evaluate the EMI level and improve the immunity of pacemakers. The Pacemaker Committee of Japan conducted immunity tests of pacemakers for mobile phones, and consequently concluded that the connector between the pacemaker housing and the lead wire of the electrode plays a major role in the EMI due to mobile phones. Based on this finding, a model for the EMI mechanism was presented, in which the internal impedance looked from the connector and the metal portion consisting of the pacemaker housing and the lead wire of the electrode were considered as a load and two halves of a receiving antenna, respectively. The EMI level induced through the connector was analyzed by using the finite-difference time-domain (FDTD) method in conjunction with a torso and mobile phone models. The modeling given here was validated by comparison with the previously reported experimental results
Keywords :
electric connectors; electrodes; finite difference time-domain analysis; land mobile radio; pacemakers; packaging; radiofrequency interference; receiving antennas; telephone sets; EMI immunity; EMI mechanism; EMI modeling; FDTD method; Pacemaker Committee of Japan; connector; electrode; electromagnetic interference; experimental results; finite-difference time-domain method; immunity tests; implanted cardiac pacemaker; induced EMI level; internal impedance; lead wire; load; mobile phone models; pacemaker housing; receiving antenna; torso; Connectors; Electrodes; Electromagnetic interference; Electromagnetic modeling; Finite difference methods; Impedance; Mobile handsets; Pacemakers; Time domain analysis; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
Type :
conf
DOI :
10.1109/ISEMC.2000.875564
Filename :
875564
Link To Document :
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