FDTD modeling of printed circuit board signal integrity and radiation

Author

Fornberg, Per E. ; Byers, Andrew ; Piket-May, Melinda ; Holloway, Christopher L.

Author_Institution

Dept. of Electr. Eng., Colorado Univ., Boulder, CO, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

307

Abstract

Increasing bus speeds between components on a printed circuit board (PCB) create many new problems for signal integrity (SI) and EMC engineers. Non-ideal ground paths can cause both signal integrity degradation and increased electromagnetic radiation. Another cause of radiation is the effects of a finite ground plane. This paper presents a study of the SI and EMC issues due to these structures based on finite-difference time-domain (FDTD) simulations

Keywords

antenna radiation patterns; electromagnetic compatibility; finite difference time-domain analysis; microstrip antennas; printed circuits; EMC issues; FDTD modeling; PCB; SI issues; bus speeds; electromagnetic radiation; finite ground plane; finite-difference time-domain; nonideal ground paths; printed circuit board signal integrity; radiation; signal integrity degradation; Degradation; Electromagnetic compatibility; Electromagnetic radiation; Finite difference methods; Microstrip; Printed circuits; Reflection; Signal analysis; Time domain analysis; US Department of Commerce;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2000. IEEE International Symposium on

Conference_Location

Washington, DC

Print_ISBN

0-7803-5677-2

Type

conf

DOI

10.1109/ISEMC.2000.875583

Filename

875583