Title :
A general approach for the analysis of finite size PCB ground planes
Author :
Celozzi, S. ; Panariello, G. ; Schettino, F. ; Verolino, L.
Author_Institution :
Dept. of Electr. Eng., Rome Univ., Italy
Abstract :
The analysis of the current distribution on ground planes of printed circuit boards is carried out by means of a very efficient dual approach and compared with numerical results. The current density inside ground planes of finite thickness is also analytically determined and the per unit length parameters evaluated
Keywords :
current density; current distribution; earthing; electric impedance; electromagnetic compatibility; electromagnetic fields; integral equations; printed circuits; EMC; MoM; characteristic impedance; current density; current distribution; dual integral formulation; finite size PCB ground planes; finite thickness ground planes; numerical results; per unit length parameters; printed circuit boards; propagation constant; radiated electromagnetic field; Circuit analysis; Current density; Current distribution; Electromagnetic compatibility; Electromagnetic fields; Fourier transforms; Impedance; Microstrip; Printed circuits; Strips;
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
DOI :
10.1109/ISEMC.2000.875593
