DocumentCode
3579681
Title
LIN validation frame-work: a novel approach
Author
Sinha, Amit ; Anand, Chetan ; Gupt, Saurabh
Author_Institution
Freescale Semicond., Noida, India
fYear
2014
Firstpage
163
Lastpage
167
Abstract
Automotive semiconductor industry is passing through an era where it is pushing the complex mechanical interconnects to be replaced by the mechatronical system. To simplify the wiring design and to handle the communication process effectively between various systems in automobiles, LIN (Local Interconnect Network) bus protocol has been designed. It is widely used in numerous applications like door locks, mirrors, rain sensors, powertrain, central ECU, etc even at very high temperature.
Keywords
automotive electrics; mechatronics; LIN validation frame-work; automotive semiconductor industry; local interconnect network bus protocol; mechatronical system; Clocks; Protocols; Silicon; Stress; Synchronization; System-on-chip; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Vehicular Electronics and Safety (ICVES), 2014 IEEE International Conference on
Type
conf
DOI
10.1109/ICVES.2014.7063741
Filename
7063741
Link To Document