• DocumentCode
    3580285
  • Title

    The research on system-level modeling technology of mixed-level abstraction

  • Author

    Yukun Song ; Kuai Cao ; Duoli Zhang

  • Author_Institution
    Inst. of VLSI Design, Hefei Univ. of Technol., Hefei, China
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Firstly, this paper introduces the classification of different abstraction level of system model and puts forward these questions needed to be solved during the establishment of system model. Secondly, it gives the analysis of the advantages and disadvantages of all existing solutions and implements the modeling based on the method of interface encapsulation. Thirdly, the paper elaborates the merits of this method, such as strung expandability, less memory usage, simple communication, etc., and introduces the concrete implementation of key parts of interface encapsulation. Finally, the paper take heterogeneous multi-core system as an example where the data communication and data processing among mixed abstraction level model have been implemented. The mixed-level model ameliorates efficiency of the model simulation evidently. The result of experiments proves that the average time saving rate of simulation of the system model of mixed abstract level reaches 92.68%.
  • Keywords
    data communication; encapsulation; integrated circuit modelling; integrated circuit packaging; network-on-chip; data communication; data processing; heterogeneous multicore system; interface encapsulation; mixed abstraction level model; model simulation; system-level modeling technology; Adaptation models; Data models; Encapsulation; IP networks; Integrated circuit modeling; Object oriented modeling; Ports (Computers); communication; data transmission; interface encapsulation; mixed abstraction level; system model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Anti-counterfeiting, Security, and Identification (ASID), 2014 International Conference on
  • Print_ISBN
    978-1-4799-7117-6
  • Type

    conf

  • DOI
    10.1109/ICASID.2014.7064955
  • Filename
    7064955