DocumentCode
3581663
Title
Design of highly-efficient monolithic silicon power amplifiers using envelope-tracking for broadband wireless applications
Author
Lie, Donald Y.C. ; Lopez, Jerry ; Li, Yan ; Tsay, Jerry
Author_Institution
Dept. of Electrical and Computer Engineering, Texas Tech University, Lubbock, 79409-3102, USA
fYear
2014
Firstpage
1085
Lastpage
1088
Abstract
A couple of design examples on highly-efficient fully-monolithic silicon-based envelope-tracking power amplifiers (ET-PA) for broadband wireless applications will be presented. These RF PAs are designed in SiGe BiCMOS technologies in either common-emitter (CE) or cascode topologies, as SiGe can deliver higher POUT with better breakdown robustness than their CMOS counterparts. The envelope modulator (EM) ICs are designed in CMOS to mate with PAs to form high-efficient monolithic SiGe BiCMOS ET-PA systems. Using 5/10/20 MHz LTE 16-QAM modulated inputs, these ET-PA systems can achieve 24–28 dBm linear POUT , passing stringent LTE linearity specs with overall system power-added-efficiency (PAE) above 40% without predistortion.
Keywords
BiCMOS integrated circuits; CMOS integrated circuits; CMOS technology; Decision support systems; Gallium arsenide; Silicon germanium; WiMAX; Envelope-tracking (ET); SiGe; envelope modulator (EM); envelope shaping method; long-term evolution (LTE); power amplifier (PA); through-silicon-via (TSV);
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (APMC), 2014 Asia-Pacific
Type
conf
Filename
7067672
Link To Document