• DocumentCode
    3581663
  • Title

    Design of highly-efficient monolithic silicon power amplifiers using envelope-tracking for broadband wireless applications

  • Author

    Lie, Donald Y.C. ; Lopez, Jerry ; Li, Yan ; Tsay, Jerry

  • Author_Institution
    Dept. of Electrical and Computer Engineering, Texas Tech University, Lubbock, 79409-3102, USA
  • fYear
    2014
  • Firstpage
    1085
  • Lastpage
    1088
  • Abstract
    A couple of design examples on highly-efficient fully-monolithic silicon-based envelope-tracking power amplifiers (ET-PA) for broadband wireless applications will be presented. These RF PAs are designed in SiGe BiCMOS technologies in either common-emitter (CE) or cascode topologies, as SiGe can deliver higher POUT with better breakdown robustness than their CMOS counterparts. The envelope modulator (EM) ICs are designed in CMOS to mate with PAs to form high-efficient monolithic SiGe BiCMOS ET-PA systems. Using 5/10/20 MHz LTE 16-QAM modulated inputs, these ET-PA systems can achieve 24–28 dBm linear POUT, passing stringent LTE linearity specs with overall system power-added-efficiency (PAE) above 40% without predistortion.
  • Keywords
    BiCMOS integrated circuits; CMOS integrated circuits; CMOS technology; Decision support systems; Gallium arsenide; Silicon germanium; WiMAX; Envelope-tracking (ET); SiGe; envelope modulator (EM); envelope shaping method; long-term evolution (LTE); power amplifier (PA); through-silicon-via (TSV);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (APMC), 2014 Asia-Pacific
  • Type

    conf

  • Filename
    7067672