DocumentCode
3581962
Title
Radiation pattern measurement assembly for millimeter-wave antenna by flip-chip interconnect and end launch connector
Author
Lu, Hsin-Chia ; Chang, Yi-Long
Author_Institution
Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan
fYear
2014
Firstpage
131
Lastpage
133
Abstract
This paper presents an antenna measurement assembly for millimeter-wave antenna pattern measurement. The assembly consists of antenna under test (AUT) with ground signal ground (GSG) pad, flip-chip interconnect using gold studs with non-conductive film (NCF), a connection substrate, and an end launch coaxial connector. Flip-chip interconnects using gold studs and NCF are utilized to provide low parasitic signal path between AUT and grounded CPW on the connection substrate. An end launch coaxial connector is then screwed at the other end of GCPW for handy antenna pattern measurement in anechoic chamber. The coaxial connector also can be detached and reused again. A patch antenna fabricated in low temperature cofired ceramic (LTCC) is used as AUT for antenna pattern measurement. The operating frequency is from 58 GHz to 64 GHz. The measurement results of radiation patterns agree well with simulation.
Keywords
Antenna measurements; Antenna radiation patterns; Assembly; Connectors; Flip-chip devices; Probes; Substrates; LTCC; flip-chip; millimeter-wave antenna; non-conductive film (NCF); radiation pattern measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (APMC), 2014 Asia-Pacific
Type
conf
Filename
7067971
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