DocumentCode :
358316
Title :
A nonstationary model for vacuum arcs with refractory hot anode
Author :
Beilis, I.I. ; Boxman, R.L. ; Goldsmith, S.
Author_Institution :
Electr. Discharge & Plasma Lab., Tel Aviv Univ., Israel
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
226
Abstract :
A new form of arc, termed the refractory hot anode vacuum arc (HRAVA), was analyzed. The HRAVA has a thermally isolated anode and a cooled cathode. The arc operates initially as a multi-cathode-spot vacuum arc, and material from the cathode spot jets deposits on the anode. During a transition stage, the arc heats the anode and evaporates the material deposited thereon, forming an anode plasma plume. A system of time-dependent equations were formulated and solved for the heat flux from the plasma to the anode surface, heat conduction within the anode, electron energy balance and heavy particle conservation in the anode plasma. The calculations show that the plasma electron temperature decreases while the anode temperature and plasma density increase with time. The model results agree well with previously measured data
Keywords :
anodes; cathodes; heat conduction; plasma density; plasma jets; plasma temperature; vacuum arcs; anode heating; anode plasma; anode plasma plume; anode surface; anode temperature; cathode spot jets; cooled cathode; deposited material evaporation; electron energy balance; heat conduction; heat flux; heavy particle conservation; multi-cathode-spot vacuum arc; nonstationary model; plasma density; plasma electron temperature; refractory hot anode; refractory hot anode vacuum arc; thermally isolated anode; time-dependent equations; vacuum arcs; Anodes; Cathodes; Conducting materials; Electrons; Equations; Plasma density; Plasma materials processing; Plasma measurements; Plasma temperature; Vacuum arcs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 2000. Proceedings. ISDEIV. XIXth International Symposium on
Conference_Location :
Xi´an
Print_ISBN :
0-7803-5791-4
Type :
conf
DOI :
10.1109/DEIV.2000.877291
Filename :
877291
Link To Document :
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