• DocumentCode
    3584760
  • Title

    A new approach for generating compact thermal models

  • Author

    Lagha, Hajer ; Chazal, Herve ; Belmabrouk, Hafedh

  • Author_Institution
    G2Elab, Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Thermal models are more and more used to simulate power electronic devices. For example, in aeronautic domains, the numerical validation of prototype in high temperature environment is very important. Thermal modeling is generally performed using finite element or finite volume methods, which are difficult to integrate in the design procedure. These simulations must then combine different software and lead to important computation times. To develop reduced models, many methodologies are proposed as: the thermal quadrupoles method [1][2][3], the nodal method [4], Pole Analysis via Congruence Transformation (PACT) method [5] and thermal matrix description. All these methods allow developing conductive thermal models with a limited number of unknowns and are called compact thermal models. This paper focuses on how the thermal matrix description methodology can be used with finite element method to generate reduced models that are boundary-condition-independent. This method is successfully used in the present study to generate reduced models for 1D and 2D.
  • Keywords
    finite element analysis; finite volume methods; power electronics; thermal engineering; PACT method; compact thermal models; finite element method; finite volume method; pole analysis via congruence transformation method; power electronic devices; thermal matrix description methodology; thermal quadrupoles method; Boundary conditions; Computational modeling; Heating; Impedance; Mathematical model; Numerical models; Surface impedance; Conduction; Equivalent Circuit; Impedance; Thermal Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Sciences and Technologies in Maghreb (CISTEM), 2014 International Conference on
  • Type

    conf

  • DOI
    10.1109/CISTEM.2014.7076976
  • Filename
    7076976