Engineering science considerations for integration and packaging

The first level of packaging relates integrating semiconductor power devices together with their drive circuitry in a suitable housing. At higher levels, passive components will be included in the same package and eventually complete power electronic converters will be integrated. Not only new technologies will be introduced but the methods for analyzing and designing power electronic circuits will change. In this paper, various engineering science aspects of packaging and integration are discussed. An overview of the challenges that lie ahead in this relatively young category in power electronics is presented