DocumentCode
3587483
Title
Analysis of SRAM cell designs for low power applications
Author
Sharma, Chandresh Kumar ; Chandel, Rajeevan
Author_Institution
VLSI Design Autom. & Tech., Nat. Inst. of Technol. Hamirpur (H.P.), Hamirpur, India
fYear
2014
Firstpage
1
Lastpage
4
Abstract
SRAM is a main part of cache, therefore its power consumption reduction has always been researched. The present work aims to reduce leakage power without affecting the logic state of SRAM cell. For achieving this subthreshold operation is carried out. Furthermore two different techniques are analyzed for the same namely forced stack transistor technique and sleep transistor technique. It is seen from the analysis that sleep transistor technique shows less average power dissipation compared to others whereas forced stack transistor technique gives minimum average delay compared to others. A convincing power reduction is achieved in a SRAM cell with minimum critical path delay using sleep transistor technique. Simulations are carried out using TSPICE for 90nm, 45nm and 32nm CMOS technology nodes. For subthreshold operation the supply voltage 0.35V is used.
Keywords
CMOS memory circuits; MOSFET; SRAM chips; integrated circuit design; low-power electronics; CMOS technology; SRAM cell design; TSPICE; forced stack transistor technique; leakage power consumption reduction; low power application; minimum critical path delay; power dissipation; size 32 nm; size 45 nm; size 90 nm; sleep transistor technique; Delays; Power dissipation; SRAM cells; Switching circuits; Threshold voltage; Transistors; Critical path delay; Leakage power Dissipation; Sub-micron; Supply voltage and Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Convergence of Technology (I2CT), 2014 International Conference for
Print_ISBN
978-1-4799-3758-5
Type
conf
DOI
10.1109/I2CT.2014.7092157
Filename
7092157
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